Substrate:UV Fused Silica
Dimensional kam rau ua:-0.1 hli
Thickness kam rau ua:± 0.05 hli
Nto Flatness:1 (0.5) @ 632.8nm
Nto Zoo:40/20
Ntug:Hauv av, 0.3mm max. Tag nrho dav bevel
Clear Aperture:90%
Centering:<1'
Txheej:Rabs <0.25% @Design Wavelength
Damage Threshold:532nm: 10J / cm², 10ns mem tes
1064nm: 10J / cm², 10ns mem tes